Dual-Inline Package

A Dual-Inline Package (DIP) is a specific style of electronic component wherein the electrical connections to the package are arranged in two rows of leads that use industry-standard spacings. The Dual-Inline Package is designed to package components that are mounted on a printed circuit board.

JEDEC-standard DIPs have the inter-lead spacing specified as 0.1" and the row spacing is specified at 0.3".