Flip chip

A flip chip is one type of IC chip mounting which does not require any wire bonds. Instead the final wafer processing step deposits solder beads on the chip pads. After cutting the wafer into individual dice, the "flip chip" is then mounted upside down in/on the package and the solder reflowed. Flip chips then normally will undergo an underfill process which will cover the sides of the die, similar to the encapsulation process. The terminology flip chip originates from the upside down (i.e. flipped) mounting of the die.

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