Pin grid array
The
pin grid array or
PGA is a type of packaging used for
integrated circuits, particularly
microprocessors. The integrated circuit (IC) is mounted in a
ceramic slab of which one face is covered, or partially covered, in a sqaure array of metal pins. The pins can then be inserted into the holes in a
printed circuit board and soldered in place. They are almost always spaced a tenth of an
inch (2.54
mm) apart. For a given number of pins, this type of package occupies less space than older types such as the
dual in-line package (DIL or DIP).
The plastic pin grid array (PPGA) and later flip-chip pin grid array (FCPGA) versions were both created by Intel Corporation for their Pentium processors, and are often used on motherboards with ZIF sockets to protect the delicate pins.