The wire is generally made up of one of the following:
Wire diameters start at 15µm and can be up to several hundred microns for high-powered applications.There are two main classes of wire bonding:
In either type of wire bonding, the wire is attached at both ends using some combination of heat, pressure, and ultrasonic energy to make a weld.
Wire bonding is generally considered the most cost-effective and flexible interconnect technology, and is used to assemble the vast majority of semiconductor packages.